DDR5 accelerates penetration, and the sealed test tap brings new news
5/22/2023 1:47:42 PM
With the continuous improvement of storage system performance requirements in 5G high-speed networks, cloud servers, intelligent vehicles and other fields, DDR5 chips are accelerating penetration in servers, data centers and other fields. Compared with previous generation products, DDR5 brings users better reliability and scalability due to its advantages of faster speed, lower energy consumption, higher bandwidth, and larger capacity, and has broad market prospects.
Reflected in the finished chip manufacturing process, the performance of memory chips, including DDR5, continues to improve, putting forward higher integration, better electrical performance, lower latency, and shorter interconnect requirements for chip packaging.
To this end, JCET achieves high storage density performance in devices of the same size through a variety of advanced 2.5D/3D packaging technologies to meet the needs of the market.
At present, Changdian Technology's process capability can realize the stacking of 16 layers of chips, the thickness of a single layer of chips is 35um, and the thickness of the package is about 1mm. All kinds of storage products including DDR have been mass-produced.
Jcet said that with the continuous improvement of storage system performance requirements in PC, server, and consumer fields, the market demand for DDR5 is expected to accelerate release, bringing new opportunities for integrated circuit sealing and testing.
Reflected in the finished chip manufacturing process, the performance of memory chips, including DDR5, continues to improve, putting forward higher integration, better electrical performance, lower latency, and shorter interconnect requirements for chip packaging.
To this end, JCET achieves high storage density performance in devices of the same size through a variety of advanced 2.5D/3D packaging technologies to meet the needs of the market.
At present, Changdian Technology's process capability can realize the stacking of 16 layers of chips, the thickness of a single layer of chips is 35um, and the thickness of the package is about 1mm. All kinds of storage products including DDR have been mass-produced.
Jcet said that with the continuous improvement of storage system performance requirements in PC, server, and consumer fields, the market demand for DDR5 is expected to accelerate release, bringing new opportunities for integrated circuit sealing and testing.
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